Shop Floor Control (SFC), Responsible Business Alliance (RBA) Requirements, manufacturing processes , Engineering Change Order (ECO), New Product Introduction (NPI), SAP, Kaizen, Root Cause Analysis, Process Engineering

design of experiments (DOE), coordinate measuring machines (CMMs), Siemens NX UG, polymer rheology, optical-grade polymers, CADMOULD, Autodesk Moldflow, polariscopes, injection molding machines, structural polymers, Moldex3D, mold flow simulation, precision mold design, Creo, Heat Transfer, optical interferometry

Space, PROMIS SiView DC OP, Fmea, PVD equipment, Ms Office Applications, Jmp, SPC charts

pick-and-place (PnP), reconstitution, data analysis tools, Fmea, Spc, advanced packaging technologies, lithography, wet processes, 8D, recon molding, die preparation, semiconductor processes, fan-out wafer-level packaging, Fishbone, Doe, NPI process development, root cause analysis tools, MES systems