Qualify new BOM, materials, tools, equipment and processes for eWLB products.
Support new device introduction and engineering qualification lots across eWLB Pre-assembly, Recon, RDL and Backend processes.
Ensure new products meet required quality, yield and productivity targets.
Provide technical expertise to sustain and optimise eWLB processes.
Ensure products meet customer requirements and specifications.
Support the smooth transition of products from engineering qualification to LVM and HVM.
Drive process improvement and optimisation using DOE, JMP and data analysis.
Support the qualification of new and alternative materials, tools and equipment.
Review FMEA, OCAP and Control Plans to improve yield and assembly performance.
Participate in cost reduction and productivity improvement projects.
Work with Engineering, Quality, Manufacturing and Operations teams to resolve technical issues and support successful product qualification and ramp-up.

Required Experience and Qualifications

Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Chemical Engineering, Physics, Materials Science or a related discipline.
2-5 years of relevant semiconductor/wafer process engineering experience preferred.
Experience in eWLB, wafer-level packaging, RDL, backend assembly or related semiconductor processes will be an advantage.
Familiar with DOE, FMEA, SPC and 8D methodologies.
Proficient in data analysis using JMP.
Strong analytical and problem-solving skills, with the ability to interpret process data and drive process improvements.
Good communication and cross-functional collaboration skills.
Self-driven and good communications skills
Location: Yishun
Mon To Fri 8am -518pm
Salary up to $6000

JOB ID: GTJK010

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Kindly email your resume in a detailed Word format to [HIDDEN TEXT]

We regret that only shortlisted candidates will be notified

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