Realtime Defect Analysis (RDA) systems and workflows, Root Cause Analysis, Large dataset interpretation, Semiconductor process integration, Statistical data analysis correlation development, Technology Development, Optical and e-beam inspection technologies

wafer BE, plasma dicing, Fmea, Spc, Iso, packaging materials process interactions, die sort, industry standards IPC, Failure Analysis, Cu pillar bumping, ANSI, stealth dicing, packaging design rules, JEDEC, singulation, FAB BEOL process knowledge, qualification reliability testing, IEEE

Supplier Audits, Critical Parameters Monitoring, Continuous Improvement, Technical Support, Process Excellence, Supplier Quality Management, Failure Analysis, First Article Qualification

material properties , Structural Analysis, 3D CAD modelling, servo linear motor, dynamic measurement tools, GD&T standards, Fem, detailing drawings, piezo actuator, Modal Analysis, machining practices, mechanical subsystem design, structural vibrations, servo control design

manufacturing processes , Tooling, equipment qualification, laser assembly, laser modules, Soldering, Bonding, Fixtures, optical assemblies, photonics devices, technical support, DPSS nano-second pulsed laser technologies, optical alignment, Calibration, root-cause analysis

Quality Assurance, Supplier Qualification, Product Development, Regulatory Affairs, Design Quality, Manufacturing Transfer Activities, Design Controls, Product Lifecycle Management, Quality Systems, Risk Management