silicon photonics , high-speed SerDes, 2.5D 3D chiplets, Failure Analysis, optical electrical test equipment, simulation modeling tools, heterogeneous integration, photonic devices, fiber-to-chip coupling, board system-level reliability, advanced packaging, accelerated stress testing, reliability qualification methodologies, reliability qualification, optical characterization, Signal Integrity, CPO NPO architectures, data-driven insights, optical packaging, optical interconnects, reliability modeling, high-speed interconnect