Ms Office, Plasma chemistry, Python coding, Dry Etch technology, plasma physics, SAS software, Data science basics, Statistical Process Control

SAP, Ms Office, Excel, AOI, Statistical Analysis, Quality Systems, cleanroom practices, AI inspection, Spc, Root-cause analysis, Jmp, Capa, Minitab, Continuous Improvement, manual inspection, FACA, Mes

packaging materials , Ipc, wafer BE, plasma dicing, Fmea, Reliability, Spc, Iso, die sort, Failure Analysis, Cu pillar bumping, Statistics, wafer singulation, ANSI, failure mechanisms, JEDEC, stealth dicing, process interactions, IEEE, qualification reliability testing

semiconductor process technology , Reliability and qualification methodologies, Statistics and data analysis techniques, AI and machine learning tools, Design-for-test methodology

Chemistry, wet etch technology, Thermodynamics, physical phenomena, AI-assisted tools, films and interface engineering, mass transport, chemical kinetics, data analysis systems, EDX, sims, TEM, Sem, Xps

Statistical Analysis, Statistical process controls, process integration, Manufacturing Process, Backend and Reliability implications, device physics, Fabrication processes

Statistical Analysis, SAP, Ms Office, Excel, AOI, Quality Systems, AI inspection, Spc, Root-cause analysis, gd&t, Cleanroom practices, Capa, Jmp, Minitab, Manual inspection, FACA, Mes, Continuous Improvement

silicon photonics , cleanroom operations, yield analysis, cvd, Etch, process integration, lithography, wafer fabrication, PVD, fab process engineering

Ms Office, System design involving multiple axes servo pneumatic actuators, Stepper and other drive sensing methods, Motion systems and mechanism designs