TEM Transmission Electron Microscopy, FIB Focused Ion Beam, EBSD Electron Backscatter Diffraction, EDX, Sem

Advanced Analytics, Machine Learning, automation, digital manufacturing solutions, Ai, process capability improvements, CVD equipment

fib, defect characterization, recipe creation, EDX, Sem, defect source knowledge, OM

reflow systems, stripping, Cleaning, Plating, electrical troubleshooting, wafer bumping equipment, lithography, PVD, sputtering

serial communication , Device Drivers, Socket Programming, Microservices, Memory Management, Agile, Cloud Computing, multi-threading, cloud security, Rup, Cloud Architecture, UML modelling, latency, multi-tier architecture, Windows platforms, inter-process communication, Embedded Systems, cloud-native services, SDLC methodologies, hardware components, software-hardware integration, real-time processing, low-level software optimisation, object-oriented software design

Information Systems, Maintenance management software solutions, Electronics Engineering, Computer Science, Data governance framework, Sustainable Infrastructure Engineering