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Showing 2 jobs
Skills:
Advanced Analytics, wire bonding, wafer-level packaging, photonics packaging, advanced semiconductor assembly, flip-chip bonding, advanced interconnect processes, eutectic bonding, statistical methodologies, precision optical alignment, die attach, wafer bumping, packaging technologies
Skills:
Advanced Analytics, wire bonding, wafer-level packaging, photonics packaging, advanced semiconductor assembly, flip-chip bonding, advanced interconnect processes, eutectic bonding, statistical methodologies, precision optical alignment, die attach, wafer bumping, packaging technologies
