Job Responsibilities:

Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
Upload recipe, check recipe and ensure recipe content compliance using RMS.
Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers.
Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required.
Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices.
Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements.
Resolve complex technical issues in own Module or yield related issues
Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Requirements:

Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
Min 2 years of relevant work experience in Thin Film CMP Process.
Knowledge in Wafer fabrication process.
An excellent team player with good interpersonal, communication and written skills
Strong logical thinking capability and good analytical skill
High level of integrity with strong leadership attributes to lead and coach a team
Highly committed with good ownership and accountability
Able to adapt in a fast pace environment and work under pressure
Proficient in MS Office Applications

Senior Engineer/Engineer (Thin Film - CMP Process)