Python Scripting, Material characterization, Multiphysics analysis, Computational Fluid Dynamics, CAD proficiency in SolidWorks, Finite Element Analysis, Thermal-mechanical analysis

semiconductor packaging , thermal analysis , mold flow analysis, material characterization, assembly process integration, Back-End Assembly, Failure Analysis, EMC Epoxymoulding Compound, thermo-mechanical analysis, EMC material development, package reliability, reliability assessments

regulators , receivers , Dac, Python Scripting, mixer, Oscillators, Temp Sensors, Transmitters, Pa, RF General, bandgaps, submicron CMOS technologies, RF modules, Dfm, parasitic reduction, linear switched ADC, VCO, Amplifiers, LNA, Cadence Virtuoso VXL, Mentor Calibre, Analog Mixed Signal Design, Esd, Analog Layout, Pll

project management tools and methodologies, statistics data analysis, chemical processes and materials specific to lithography, optics and immersion lithography principles, material properties and methods for characterization, lithography simulation programs, inventing and refining technologies