Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans

Solidworks, Matlab, Python, Spc, Autocad, 8D, Six Sigma, dispensing and pick place process, Jmp, Statistical Process Control methodologies, Minitab, data analysis packages, Doe

Preventive Maintenance, 8D methodologies, tool logs, standard operating procedures, MTTR, vendor field service engineers, metrology data, equipment health monitoring, Fmea, Spc, FDC, EHS regulations, recipe releases, Mtbf, cip, complex troubleshooting, Process Engineering, Root Cause Analysis, Lean Six Sigma, ISO Automotive Quality Management Systems, Oee, baseline control, Mattson tools