Python Scripting, Material characterization, Multiphysics analysis, Computational Fluid Dynamics, CAD proficiency in SolidWorks, Finite Element Analysis, Thermal-mechanical analysis

layout verification , Java, Python, BCD technologies, planar CMOS, FinFET, EDA Tools, Mentor, Cadence, Analog Mixed Signal modules, Synopsys

Python Programming, Code Analysis, Validation activities, Firmware debugging, Firmware analysis, Firmware design, Issue isolation, Embedded firmware development using C, Low-level software development including assembly language programming, Root cause investigation

Quality tools such as FMEA and 8D, Module testing process, DFQ, Customer Management, DFX, Module packaging process, Failure Analysis, Validation, Reliability, Qualification

transistors , Pds, Reliability, quality tools such as FMEA, LEDs, operating principles of diodes, 8D, DFQ, ASICs, Product Quality, semiconductor backend processes, DFX, module packaging, quality issue resolution, Validation, Product Engineering, Customer Management, Qualification, semiconductor device physics, module testing process, advanced product quality, VCSELs, Customer Quality Management, Failure Analysis, Reliability Failure Analysis

Python, primetime, Synopsys Design Compiler, Tcl Shell, Formality, VCLP, Synopsys Fusion Compiler, Cadence Genus, VC SpyGlass

semiconductor packaging , thermal analysis , mold flow analysis, material characterization, assembly process integration, Back-End Assembly, Failure Analysis, EMC Epoxymoulding Compound, thermo-mechanical analysis, EMC material development, package reliability, reliability assessments

Regression Analysis, Nvme, Continuous Integration, Pcie, Agile Development, Python Programming, Ocp, NAND flash operation, SSD firmware testing, firmware verification planning, automated build, SSD firmware components, SSD system-level debugging, test coverage analysis, branch management, storage protocols and specifications, NVMe-MI, test automation systems, Git development flow, Reporting