fib, nano-probing techniques, high-energy beam systems, AFM, site-specific preparation, Failure Analysis, materials characterization, electron microscopy, plasma FIB sample preparation, TEM, transistor nano-probing, electrical characterization, device physics

material analysis , Semiconductor wafer processing, electron microscopy, Failure analysis of advanced microprocessors and graphics processors, Materials characterization, Transistor nano-probing, Yield failure analysis, Electrical characterization, Large-volume material removal, 3nm FINFET and below technologies, Defect localization, Tool troubleshooting, Planar cross-sectional and site-specific preparation, Plasma FIB sample preparation