silicon photonics , 2.5D 3D chiplets, Fmea, reliability qualification, high-speed interconnect, optical characterization, high-speed SerDes, reliability qualification methodologies, optical electrical test equipment, optical interconnects, Doe, corrective preventive actions, reliability modeling, CPO NPO architectures, heterogeneous integration, board system-level reliability, photonic devices, Signal Integrity, accelerated stress testing, Failure Analysis, optical packaging, simulation modeling tools, fiber-to-chip coupling, advanced packaging

Statistical Analysis, Mechatronics Engineering, Mechanical Engineering

Statistical Analysis, NAND device structures, Electrical characterization, Big Data and database queries, Physics-based modeling of non-volatile memory, Reliability Analysis, JEDEC standards