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Skills:
HBM (High Bandwidth Memory), Wafer Probe Equipment, Mechanical stress analysis, design of experiments, Data Analysis, Project management, Electro-mechanical controls and components, Semiconductor device test methodology, Statistics, AI-assisted tools, Materials selection, Thermal systems, Probe Processes, Electrical circuits, 3D CAD software, Ms Office Products, Semiconductor processes, Machine Design
Skills:
Golang, Sql, Google Cloud, Distributed Systems, Rest Apis, middleware, Python, integration toolsets, Data Processing, Linux operating systems, AI agents for coding analysis and automation, Enterprise Networking, ETL pipelines
