PLA (Plasma), wafer bonding , RTP (Rapid Thermal Processing), Overhead Hoist Transport (OHT) systems, ICP-MS analysis, Vertical Furnaces, Cleaning, Single wafer cleaning, polishing, AMHS equipment, Wet bench, Thickness measurement, Sorting, Stockers, Wafer particle inspection, Metrology equipment, Automation systems, Packaging

BGA package, Jmp, Excel Office Suite, Semiconductor Manufacturing