ocap, CQM, ISO14001 2004, Fmea, Spc, IC assembly processes, ESEC ASM KNS wire bonders, Encapsulant epoxy, Material science of bonding wires, ISO9001 2000, Structural substrates, Doe, JEDEC, QEMS

Data Analysis, Product Testing, optical transceiver assembly processes, wire bond, general assembly, burn-in, die attach, active optical alignment, quality management systems

Testing, encapsulation, ocap, wire bonding, Fmea, Spc, IC assembly processes, Equipment Maintenance, Iso 9001, die attach, Doe, JEDEC, KNS wire bonders