Hardware evaluations, Process monitoring and control methodologies, Process development, Advanced Replacement Gate 3D NAND, Research And Development, Dry Etch

SAP, Data Analysis, Fmea, Ms Office Applications, Quality Tools, Control Plan

Descum, Fmea, lithography, Spc, Ball drop process, Etching, Sputter, Jmp, APQP standard, Project Management Certification, WLCSP bumping process, 2P2M DOE, Plating

Problem Solving Techniques, WLCSP, Dmaic, Fmea, Wafer Sort, Spc, Final Test, Doe, Statistics, 8D, manufacturability

Statistical Analysis, Iso 13485, Fmea, Validation protocols, FDA QMSR 21 CFR Part 820, Spc, Gmp, Msa, Quality Tools

Measurement instruments, cvd, Fmea, Thin Film Equipment, PROMIS DC OP, Wafer fabrication, Ms Office Applications, PVD, Jmp, SPC charts

MATLAB, Design to Manufacturability, Electrical Electronics Engineering, Schematic and layout review of PCBs, Fmea, Design to cost, Basic Safety EMS ESD electrical interferences