silicon photonics , high-speed SerDes, 2.5D 3D chiplets, Failure Analysis, optical electrical test equipment, simulation modeling tools, heterogeneous integration, photonic devices, fiber-to-chip coupling, board system-level reliability, advanced packaging, accelerated stress testing, reliability qualification methodologies, reliability qualification, optical characterization, Signal Integrity, CPO NPO architectures, data-driven insights, optical packaging, optical interconnects, reliability modeling, high-speed interconnect

silicon photonics , 2.5D 3D chiplets, Fmea, reliability qualification, high-speed interconnect, optical characterization, high-speed SerDes, reliability qualification methodologies, optical electrical test equipment, optical interconnects, Doe, corrective preventive actions, reliability modeling, CPO NPO architectures, heterogeneous integration, board system-level reliability, photonic devices, Signal Integrity, accelerated stress testing, Failure Analysis, optical packaging, simulation modeling tools, fiber-to-chip coupling, advanced packaging