Welcome to Micron's Advanced NAND Process Pathfinding Team - where the next generation of memory technology is developed. We operate at the innovative edge of semiconductor progress, engineering world-class memory solutions crafted for uncompromising performance. If you're ready to invent what's possible in NAND process technology, we'd love you on this journey with us.

As a Principal Engineer / Member of Technical Staff (MTS) - Dry Etch, you'll spearhead groundbreaking initiatives alongside some of the industry's most accomplished technologists. Your mission: architect and deploy next-generation plasma etch solutions that enable future NAND scaling and novel device architectures. This is a role for a technical leader who thrives on solving the toughest challenges in plasma processing, pattern transfer, process integration, and technology development driven by advanced tools.

Responsibilities:

Develop and refine dry etch processes to satisfy NAND roadmap criteria for structure, performance, and yield.
Guide the development of next-generation etch solutions, encompassing high aspect ratio patterning, selective etch, profile control, and CD management.
Evaluate new plasma chemistries, process technologies, and hardware to enable future device scaling.
Collaborate with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, Device, and other teams to drive technology development and manufacturability.
Leverage AI-enabled engineering tools, advanced analytics, and digital workflows to accelerate process development, improve decision-making, enhance knowledge management, and increase R&D productivity across thin film technology initiatives.

Minimum Qualifications:

Extensive experience in ICP/CCP plasma etch for advanced semiconductor process development.
Deep understanding of plasma etch equipment, plasma-surface interactions, etch chemistry, and profile control.
Solid foundation in plasma physics, transport phenomena, and materials interactions.
Demonstrated experience in developing and qualifying advanced dry etch processes.
Familiarity with AI/ML, statistical modeling, data analytics, and digital engineering methodologies.
Demonstrated technical leadership and successful engagement with equipment and materials suppliers.

Preferred Qualifications:

PhD/MS with 7-10+ years of relevant experience in dry etch / semiconductor process development.
Experience in high aspect ratio etching, advanced pattern transfer, selective etching, and complex structure engineering.
Experience applying machine learning, automation, predictive modeling, or virtual process modeling in semiconductor R&D.
Strong problem-solving, communication, and presentation skills.
Experience mentoring engineers and leading technical teams.

Join a team where curiosity is currency, collaboration is culture, and your work directly builds the memory that powers AI, mobile, automotive, and data center innovation worldwide. If pushing the boundaries of NAND technology excites you, this is where you belong!

Principal Engineer / MTS NAND Process Pathfinding Dry Etch