As a Principal Engineer in the Advanced Package Technology Development team at Micron, you will join a dynamic group focused on innovation and collaboration. This role lets you influence solutions that align with company goals. It contributes to increased revenue and strategic successes. You will work at our Boise campus and help develop leading technology in the industry.

Responsibilities and Duties include, but not limited to:

Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
Collaborate continuously with internal and external partners to ensure seamless technology integration.
Consult and influence technical and strategic decisions at senior management levels.
Lead multi-disciplinary technical teams and task forces to achieve strategic goals.
Maintain effective communication with collaborators.
Analyze and understand competitive trends to improve Micron's competitive edge.
Participate actively in technology events, contributing to industry knowledge.
Guide the development of packaging technology roadmaps.
Assess competitive metrics through data intelligence for strategic advantage.
Define requirements with proven technical data and content.
Demonstrate profound technical expertise to develop new technologies and guide others.
Build an extensive technical network across various domains.
Troubleshoot advanced issues, providing mentorship for resolution.
Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.
Engage in and promote ongoing cost reduction and quality improvement initiatives.

Qualifications and Skills:

Over 5 years of professional experience in semiconductor advanced packaging.
BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience.
Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding (Required).
Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process (Required).
Experience in DRAM manufacturing and OSAT companies (Required).
Understanding of DRAM wafer structure and process flows (Highly Preferred).
A passion for innovation demonstrated by patent inventions or published literature!

About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that transforms how the world uses information. Through our global brands - Micron, Crucial, and Ballistix - we offer the industry's broadest portfolio. We are the only company manufacturing today's major memory and storage technologies: DRAM, NAND, NOR, and 3D XPoint™ memory. Our solutions unlock financial insights, accelerate scientific breakthroughs, and improve communication worldwide.

Benefits

Our comprehensive benefits include an Employee Rewards Program, Healthcare, Paid time off, Retirement savings plans, Paid parental leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center/Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, and Casual Dress attire.

Principal Engineer Advanced Package Technology Development