
Search by job, company or skills
Showing 3 jobs
Skills:
Integrated Circuit Processing, Chemistry, Fmea, Spc, FDC Methodology, Semiconductor Devices, Wet Processing, Material Science, 8D, Process Monitoring and Control Methodologies, Chemical Engineering
Skills:
statistical data analysis , FDC, Process Optimization, structured problem-solving methodologies, 8D, dry etch processes, Dmaic, Technology Development, yield improvement, process characterization, process control systems, Data Analysis, process integration, process monitoring methodologies, process control plans, defect reduction, OCAPs, process robustness, Root Cause Analysis, process transfer, SPC monitoring, Process Documentation, process troubleshooting, APC, qualification and release activities
Skills:
wafer bonding , Reports, Process Development, process research, design of experiments, Cross-functional Coordination, wire bonding, Feasibility Studies, product manufacturability, Proof Of Concept, Engineering, characterization, Metrology Management, Communication
