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We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let's talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation. Excellent opportunity to join our Process Development team. You will conduct feasibility studies, develop new process and material development for new module technologies under research and development. Will you help us design the next generation of revolutionary Apple products
The successful candidate will have the opportunity to develop processes for next generation products in Apple's ecosystem. Responsible to establish new baseline processes by conducting proof of concept (POC) studies and Design of Experiments (DOEs). Also be responsible to define Critical-To-Quality (CTQ) metrics, their specifications and the necessary metrology tools/procedures required to measure these CTQs. Have the opportunity to develop new process equipments with the support from external vendors, and showcase analytical skills by preparing and presenting engineering reports to cross-functional teams.
Apple is an equal opportunity employer that is committed to inclusion and diversity. Apple provides reasonable accommodations to applicants with disabilities and in accordance with local requirements. Apple is a drug-free workplace.
Job ID: 152517637
Skills:
Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans