Responsibilities
- Lead system integration and technical development of vision systems for semiconductor die bonding equipment.
- Provide technical support, troubleshooting, and continuous improvement solutions for regional operations, suppliers, and customer sites.
- Conduct feasibility studies, define specifications, execute qualifications, and prepare technical documentation for customized vision solutions.
- Drive optical development focusing on optics selection, illumination design, and sensor integration.
- Support co-development activities for cameras, vision algorithms, machine accuracy calibration, and vision-related process technology.
- Serve as the primary technical interface between local Asian operations and European R&D centers.
- Set up, organize, and maintain the vision development laboratory.
Requirements
- Bachelor's or Master's degree in Physics, Optical Engineering, Electrical Engineering, or a related discipline.
- Minimum 2 years of experience in vision systems engineering, preferably within semiconductor equipment or precision machinery.
- Technical domain knowledge in optics, illumination, sensor technology, and scientific simulation tools.
- Basic understanding of electronics and electrical hardware integration.
- Willingness to travel occasionally to European R&D headquarters and regional Asian production sites as needed.
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [Confidential Information]
EA License No: 13C6305
Reg. No.: R1985234 (GOH HOOI MING)
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