Tooling Design Engineer ( Semiconductor)

Mechanical Design Engineer (Semiconductor Tooling Design)

• 5 days, 8.30am-6.15pm

• Salary: $5,500- $6,000

• Location: Central ( Ubi / Might relocate to West)

Company background:

Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools

Job Responsibilities:

• Design and development of Semiconductor Tools and mechanical systems.

• Planning, Scheduling and Costing of Tools and Mechanical Modules

• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.

• Working closely with Electrical, Vision and Software Engineers.

• Willing to work extended hours in critical phases of project execution.

Job Requirements:

• Diploma or Degree in Mechanical Engineering or related Technical disciplines.

• Minimum 3 years of design experiences in semiconductor tooling

• Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus

• Proficiency with CAD Software is a must.

• Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.

Ways to apply

Click Apply now to submit your resume and share your availability and expected salary with us!

All information received will be kept strictly confidential and will be used only for employment-related purposes.

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