Strong drive for results, balanced with effective decision-making and problem-solving skills.
Demonstrate maturity in leading, managing and execution of CI projects Lean/Total Productive Management.
Perform in-depth troubleshooting to identify the root cause of defects (down to component level) and initiate permanent corrective actions to prevent recurrence.
Analyze failure trends and data to identify systemic issues in the SMT or assembly process.
Investigate units that passed test but failed later.
Analyze returned units from customers, Determine if failure is manufacturing-related or field-induced. Compare field failures to factory test data.
Provide feedback to HQ for design and process improvements when necessary.
Support New Product Introduction (NPI) through plan test process and capacity. Conduct early failure analysis during pilot builds and Develop debug procedures for new products.
Be the technical lead to interface with customer if customer have escalation or feedback.
Skills & Qualifications:
Bachelor's or Master's degree in Electrical Engineering or Electronics Engineering.
Minimum 8 years of experience in a manufacturing environment with a strong continuous improvement culture.
Ability to read complex schematics, BOMs, and PCB layouts.
Strong understanding of PCBA test methods (ICT, FCT, Boundary Scan, Flying Probe).
Experience with test equipment (oscilloscopes, multimeters, logic analyzers and etc)
Experience with data collection and analytical tools to monitor production yield and test stability.
Understanding of manufacturing processes (SMT, wave/selective soldering)
Familiarity with ISO 9001/IATF 16949 and IPC-A-610 standards for electronic assembly
Excellent English communication skills (both written and verbal) in a multinational work environment.
Self-motivated, organized, and able to work independently.
