Test & Characterization Engineer

Wafer level packaging enables the packaging of all imagers on a wafer at the same time, where two wafers, sensor and cap wafer, are being bonded together to protect the sensors from environmental influences and furthermore creating predefined condition within the detector cavity for functional enhancement. After packaging is performed, bond pads are exposed in order to contact the chips on the wafer via probe card to a PCB for electrical functionality assessment of the imager chips.

Testing of the chip's functionality after packaging state is crucial, in order to determine characteristic, sensitivity and yield of the detector chips on the wafer.An automized routine between probe-station and thermal imager chip helps with the pre-analysis of the thermal imager die, which will subsequently need to be interpreted, in order to determine the functionality of the device.

Meridian Innovation is recruiting a skillful senior test and characterization engineer to be part of a highly talented group to support testingand characterization activities ofstate-of-the art thermal imagers for established and new products.

Meridian Innovation is a well-funded, fast growing company based in Singapore, focusing on thermal imaging for commercial application. This is a unique opportunity to join our talented and very experienced team and help shape the future of our products.

Basic Qualifications

• Being a self-motivated, creative, hard-working person with an entrepreneur mind set.
• Adaptability and willingness to learn new approaches, solutions and skills.
• Excellent communication skill and team player
• Capable of developing novel solutions to given problems
• Open minded for new opinions and inputs
• Minimum 5 years of relevant working experience in test and characterization of semiconductor chips
• Knowledge in the operation of both engineering and production wafer probers
• Experienced in loading, aligning and probing of chips on a wafer using a probecard is required
• Basics in contacting test structures using micro-manipulator
• Hands-on experience with test equipment, such as Semiconductor Analyzer, Multimeter, Oscilloscope, Power Supply, etc.
• Experience in handling and analyzing large data set gathered from chips/modules
• Knowledge of analyzing data using tools like Excel , Phyton, R, JMP
• Some experience in Programming C#/C++ is a plus.
• Experience in automized chip testing

Responsibility

• Development of test plan and enhance testing strategies, flow and procedures for optimum productivity
• Implement test concept and methodology in software/hardware and maintain software/hardware during NPI phase
• Work closely with R&D and product engineers during prototypes phase to gain product knowledge and bring test throughput and yields beyond target
• Implement necessary data analyses as suggested by R&D team
• Prepare and update standard operating procedure to standardize test processes during prototype phase
• Support team with new ideas on testing / characterization of wafer level packaged IR imager chips
• Support the development of new testing / characterization setups of thermal camera chips for mass production