Technical Program Manager

Job Summary

This position works with the sales team and factory personnel in all technical aspects of customer engagement. The TPM is responsible for first-level technical customer support, aids in developing account strategy, and provides critical feedback on UTAC's ability to align with customer needs. These activities can include technical Q&A, design generation, implementation of change notices, audit preparation and participation, resolution of technical issues, technical presentations and factory visits with the customer.

Primary Responsibility

• Drive teams across UTAC sites for the successful roll-out of new programs to high-volume manufacturing (HVM)

• Drive/lead factory/customer technical projects and serve as the point of contact for quality and NPIs

• Act as the first point of contact for technical inquiries, coordinate with the Sales, RnD and Engineering Operation teams to execute customer's requests.

• Work as an integral part of the sales process, seek out new opportunities and provide technical feasibility feedback to the sales and executive management team.

• Initiate new package requirements through Design/Simulation process, and follow through to close designs with customer.

• Manage all new devices from Design to Qualification to Production Ramp.

• Review and evaluate customer's IC product packaging requirements. Provide package solutions within the packaging capability, package roadmap, process flow and design rules of the UTAC factories.

• Determine project technical specifications, coordinate Qualification builds and closure including production ramp of all Quals built. Identify and articulate requirements of Qualification lots from customer to factory.

• Drive/lead factory/customer technical projects and serve as the point of contact for quality and NPIs

• Implements change notices; resolves technical issues

Qualification / Skills / Experience Requirements

• Experience requirement by job level:

o TPM (M1): 7+ years of experience in the semiconductor industry or related field.

o TPM (M2): 10+ years of experience in the semiconductor industry or related field.

• Bachelor's degree in Engineering; Master or advanced degree preferred.

• Good knowledge of FOL (front-of-line) and EOL (end-of-line) assembly operations

• Knowledge of DOE, reliability requirements, material selection, FMEA, Failure Analysis and other quality and statistical tools

• Self-driven and has excellent problem-solving and organizational skills for daily customer support and managing ongoing and future programs.

• Communicate and present effectively in small and large groups.

• Work independently and as a team player with customers and worldwide cross-functional teams within the organization.

• Must be proficient with MS Office Suite (Excel, Word, and PowerPoint) and knowledge in CRM.

• Willing to travel when needed.

• Flexible to work within US, Europe and Asia business time zones.

• Must be a team player comfortable working with cross-functional teams across geographic boundaries with experience in leading teams and managing projects.