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Key Responsibilities:
Customer Program Management & Technical Interface: Driving end-to-end program execution for assigned customer accounts, acting as the primary technical interface for tape-outs, engineering changes (ECN), and milestone reviews.
NPI & Tape-Out Execution: Overseeing New Product Introductions (NPI), PDK alignment, mask release validation, and lot movement tracking from initial tape-out through volume production ramp.
Yield Performance & FA Defense: Tracking product yields against target entitlement, coordinating low-yield root-cause investigations, and delivering failure analysis (FA) findings to client engineering teams.
Excursion & Lot Disposition Management: Leading customer communications regarding inline process deviations, Material Review Board (MRB) decisions, and lot dispositioning during process excursions.
Cross-Functional Operations Alignment: Partnering with Process Integration, Yield, Quality, and Fab Planning teams to optimize production schedules, cycle times, and process qualification roadmaps.
Qualifications:
Education: Bachelor's, Master's, or Ph.D. in Electrical Engineering, Microelectronics, Materials Science, or Physics.
Experience: 5+ years of hands-on experience in Technical Program Management, Customer Engineering, Device Integration, or Product Engineering within a semiconductor wafer fab environment.
If you are interested in exploring this role, or if you have relevant industry contacts who might be interested, please reach out directly with a CV to: [Confidential Information]
EA: 94C3609 | R22105422
Job ID: 153366969