Technical Program Manager - External Manufacturing Operations, Backend Engineering

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THE ROLE:

Drive & lead programs & projects within External Manufacturing Operations - Backend Engineering (EMO-BE) for advanced packaging technologies (EFB, CoWoS, WLFO) & legacy packaging solutions such as Flip Chip BGA/LGA & chiplet packages. The role focuses on ensuring robust manufacturing readiness, APQP discipline & crossfunctional alignment across both legacy & advanced packaging programs from early NPI phase through ramp.

THE PERSON:

You will have a balanced mix of strong technical knowledge & program management experience across bumping, packaging & substrate functions, with demonstrated experience in both advanced packaging (EFB, CoWoS, WLFO) & legacy solutions (e.g., Flip Chip BGA/LGA/ chiplet packages).

A collaborative team player with a strong sense of ownership and urgency, capable of driving solutions in a fastpaced, multitasking environment. The role requires excellent crossfunctional project management skills, strong interpersonal effectiveness, & clear, confident communication and presentation abilities.

KEY RESPONSIBILITIES:

• APQP ownership within EMO-BE organization which shall include advanced technologies (EFB, CoWoS, WLFO) & Flip Chip BGA/LGA/chiplet NPI gate reviews on manufacturing readiness, driving crossfunctional alignment from early NPI phase through production ramp, ensuring process, quality, and performance meet program milestones.
• Formulate, organize, coordinate, and drive interconnected programs or key initiatives with cross functional team members in accordance with the mission and goals of the organization.
• Drive Key Program deliverables/ schedules/ budget & analyze program risk and opportunities.
• Effectively communicate across organizations/ levels for program status update (both working details to the team, and executive summary for Executive communication).
• Collaborate with internal engineering counterparts and extensive engagement with the Package Engineering organization, as well as crossfunctional coordination with teams such as Procurement, Supply Chain, and Reliability.
• Drive program deliverables and providing accurate, timely program status updates and executive summaries throughout the program lifecycle.
• Developing innovative programs to support the strategic direction of the organization.

• Responsibilities may be adjusted or expanded based on business needs, as assigned by the supervisor.

PREFERRED EXPERIENCE:

• Experience in Process Integration or Product Engineering with Program Management experience.
• Strong handson experience in both Advanced Packaging (EFB, CoWoS, WLFO) and legacy packaging (Flip Chip BGA, LGA & chiplet packages).
• Proven experience with APQP, NPI phase gates, and manufacturing readiness.

• Experience in semiconductor engineering environment with NPI to HVM experience.
• Strong technical communication for executive and crosssite alignment.
• Creative, self-driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks.
• Strong interpersonal communication, analytical, project management, task & time management and excellent communication skills.
• Experience in managing horizontally across multiple internal functional organizations.
• Experience with data analytics, dashboards, or datadriven reporting is a plus.
• Professional fluency in English to support technical documentation, stakeholder communication, and crosssite engineering collaboration across the region.

ACADEMIC CREDENTIALS:

• Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering or related engineering discipline.

LOCATION:

Singapore

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Benefits offered are described: .

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's Responsible AI Policy is available

This posting is for an existing vacancy.