Technical Program Manager

We are looking for an experiencedTechnical Program Manager (TPM) who will be responsible for leading and executing multi-disciplinary engineering programs for a high-tech manufacturing environment. In this role, you will drive New Product Introduction (NPI), factory bring-up activities, process optimisation, and technical risk mitigation across the full manufacturing lifecycle, from prototype through to high-volume manufacturing (HVM).

Job Responsibilities

• Lead the full technical program lifecycle for introducing new products into the manufacturing facility, coordinating milestones across product design, process engineering, and production teams
• Apply hands-on knowledge of critical semiconductor packaging processes — including Die Bonding, Wire Bonding, and Active Alignment — to partner with engineering teams, translate technical specifications into manufacturing flows, and ensure smooth NPI handoffs to the factory floor
• Proactively identify and mitigate cross-functional risks affecting production timelines, including component shortages (lasers, photodetectors, ICs) and equipment delays
• Collaborate with quality and engineering teams to address technical bottlenecks, improve first-pass yield (FPY), and conduct root-cause analysis on manufacturing failures
• Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking covering velocity, quality, capacity, and manufacturing yield
• Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress and critical path updates
• Champion operational excellence through standardisation across design, test, and production teams

Job Requirements

• Bachelor's degree or above in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related discipline
• More than 8 years of experience in electronics, semiconductor, or optical module manufacturing
• More than 5 years in technical program management, engineering management, or technical project leadership within high-volume manufacturing environments
• Experience in optical module or datacom manufacturing is preferred
• Experience identifying and mitigating risks related to component supply, equipment readiness, and cross-functional dependencies
• Strong understanding of semiconductor manufacturing processes, including SMT/PCBA, Die Bond, Wire Bond, Active Alignment, Assembly, Test, and Burn-in
• Proven ability to manage NPI programs from prototype stage through to high-volume manufacturing
• Understanding of cost modelling, BOM structure, capacity planning, and line readiness
• Strong leadership and cross-functional coordination skills, with experience managing program dashboards and reporting
• Possess a background in process standardisation and operational excellence initiatives across engineering and production teams
• Familiarity with manufacturing metrics and quality frameworks, including FPY tracking, root-cause analysis, and yield improvement methodologies
• Excellent communication skills with the ability to engage both internal stakeholders and external customers