Technical Product Manager (Metrology, AOI & Dicing Solutions)
Location: Singapore or Penang
About the Company
We are a dynamic organization where technical insights directly shape our product roadmap and market success. Our team works closely with industry-leading customers and a global network of experts in R&D, applications, and sales to deliver cutting-edge solutions. We offer a collaborative environment with global exposure and the opportunity for professionals to grow into senior product leadership roles within the semiconductor industry.
About the Role
We are seeking a Technical Product Manager (TPM) to lead the technical and commercial success of our metrology, automated optical inspection (AOI), blade sawing, and laser dicing equipment. This individual will act as the essential technical bridge between customers, sales, applications, and engineering. You will ensure our products deliver exceptional performance while aligning with evolving industry requirements in wafer-level packaging, panel-level processing, and chiplet integration.
Job Summary
As the Technical Product Manager, you will take ownership of the technical and strategic direction for assigned semiconductor backend and advanced packaging product lines. You will play a key role in translating market needs into actionable product features while ensuring technical excellence across the product lifecycle:
- Act as the primary technical point of contact for customers, supporting sales engagements, technical discussions, and product demonstrations.
- Define product requirements, specifications, and value propositions to ensure products remain competitive and meet customer needs.
- Collaborate with engineering and R&D to prioritize product enhancements and manage the implementation of new features.
- Drive New Product Introduction (NPI) activities, including oversight of beta evaluations, performance validation, and the creation of training materials.
- Lead market and strategy development by analysing industry trends in advanced packaging, such as 2.5D/3D integration and heterogeneous assembly.
- Conduct competitive benchmarking to identify key differentiators in precision dicing, optical inspection, and metrology performance.
- Support business case development, including ROI analysis, product pricing strategies, and lifecycle management.
- Prepare and maintain detailed technical documentation, such as datasheets, application notes, and capability assessments.
- Provide on-site technical support for process optimization, troubleshooting, and customer qualification activities when required.
- Represent the company at technical conferences and trade exhibitions to gather market insights and showcase product capabilities.
Key Requirements
- Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline. An advanced degree (MSc/PhD) is preferred for those with strong specialization in semiconductor processes.
- 712 years of experience in semiconductor equipment, specifically within metrology, AOI, or singulation (blade/laser dicing).
- Proven track record in product management, applications engineering, or process development within backend or advanced packaging environments.
- Strong technical foundation in precision motion systems, optics, sensors, and process control principles.
- Deep understanding of backend processes, including wafer thinning, dicing, pick-and-place, and package inspection.
- Excellent communication and presentation skills in both English and Mandarin, with the ability to simplify complex technical topics for diverse audiences in the region.
- Analytical mindset with a demonstrated ability to translate customer pain points into actionable product features.
- Proven ability to manage cross-functional collaboration between sales, engineering, and global customers.
- Comfortable in a fast-paced environment, effectively balancing technical detail with commercial impact.
- Willingness to travel 3040% globally for customer engagements and trade events.
