Responsibilities:
- Prioritize and manage issues with cross-functional teams (Customer Service, R&D, Quality, Product Line).
- Identify key field issues and provide feedback to improve product performance and customer satisfaction.
- Offer technical guidance and remote support to Field Service Engineers (FSEs) for troubleshooting.
- Act as 2nd level support for technical and quality issues on assigned machine platforms.
- Use JIRA to manage issue resolution and meet SLA requirements.
- Participate in knowledge transfer and apply field learnings to enhance technical expertise.
- Own at least one machine platform and serve as backup for another.
- Support the Support Centre Manager in achieving department KPIs.
- Perform root cause analysis and implement preventive measures to reduce recurring issues.
- Stay current with industry trends and advancements in semiconductor equipment.
Requirements:
- Bachelor's/Master's in Electronics, Electrical or Mechatronics Engineering.
- 5+ years in Die attach process/application on a specific machine platform, project management experience.
- Analytical, proactive, detail-oriented, strong communicator, accountable, team player, works under pressure.
- AI platform proficiency safety-conscious willing to travel as needed.
- Experienced in MS-Office and JIRA are preferred.
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [Confidential Information]
EA License No: 13C6305
Reg. No.: R24121656 (CHEN JING WEI)
For candidate who applied for the advertised position is deemed to have consented to us that we may collect, use or disclose your personal information for purpose in connection with the services provided by us.
