System Engineer (TC)

Systems & Process Engineering

- Participate in the development of hardware and software modules of Die Bonder equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification).

- Define hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control).

- Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences.

- Optimization of the Die Bonder system with the focus on accuracy, stability and productivity.

- Development of Die Bonding process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement).

Customer Support

- Support internal and external customers (occasional business travel).

- Support product management on customer projects.

- Support manufacturing engineering on assembly and supplier issues.

Knowledge Management

- Interpretation, documentation and presentation of new results.

Education

- Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic.

Experience

- Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous

Expertise

- Expertise in mathematics, mechatronic or material science.

- Flair for practical work in the lab and experience with measurement equipment.

- Good command of written and spoken English.

- Microsoft office and programming knowledge.