Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature work on newly developed packaging technology and drive towards high volume manufacturing maturity
Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements
Drive capability enhancement and cost reduction projects
Requirements
Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemicalor Electrical).
8 years experience in IC substrate manufacturing technologies and processes.
Direct process and operational experience in a substrate manufacturing operations line is required.
Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.
Track record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing.
Direct process and operational experience in manufacturing environment
Experience in component quality interactions with SMT processibility is not a pre-requisite, but will be favorable
Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.
Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues. Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.
Thorough knowledge of problem solving methodologies and failure analysis techniques. Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations. Demonstrate good communication skills in problem resolution.
Have a very good command on spoken and written English, Fluent in Mandarin
Willing to travel throughout Asia to support manufacturing locations.
