Staff Packaging Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), this role is required to drive thermal cooling manufacturing suppliers on delivering key performance indices in terms on issue free New Product launch/ramp up, consistency with predictable outcome in HVM and enabling new manufacturing capabilities.

THE PERSON:

You must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. You would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills. Be creative and think out of box to challenge current process / design, provide constructive and objective idea with cost and efficiency improvement.

KEY RESPONSIBILITIES:

• Facilitate DFY/DFM through close coordination with AMD's internal core team and external suppliers during NPI introduction, ensuring consistent large-scale production of complex cooling architectures such as microchannel cold plates.
• Establish manufacturing readiness in terms of process /equipment/ control setup prior to product launch.
• Drive suppliers to improve processes throughout the product lifecycle.
• Drive suppliers on issue resolution and issue prevention
• Plan and execute change management from internal or external parties.
• Drive supplier to establish manufacturing analytics to prevent issue excursion.
• Involve in regional supplier management - drive to meet Key Performance Indices
• Overseas travelling as required.
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Experience in Thermal Cooling manufacturing HVM facility/ experience in supplier management of thermal cooling manufacturing.
• Strong knowledge in heat transfer, thermal cooling solution for board/rack level to data center standards. (thermal cooling simulation is added advantage).
• Track record of development/manufacturing control work leading to volume production in thermal cooling fabrication to support board/rack level thermal cooling performance.
• Good leadership and interpersonal relationship.

ACADEMIC CREDENTIALS:

• Bachelor's or Master's degree in Mechanical Engineering or Materials Science.

LOCATION:

Singapore

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Benefits offered are described: .

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's Responsible AI Policy is available

This posting is for an existing vacancy.