THE ROLE:
You will lead NPItoHVM transitions and drive endtoend DFM integration between the advanced package technology team and external manufacturing sites, ensuring manufacturable designs, stable rampup, and highvolume production readiness across a complex external manufacturing ecosystem.
You will own advanced package industrialization and highvolume manufacturing readiness across Enterprise, Client, and AI accelerator product portfolios, with a particular focus on technologies such as CoWoS (2.5D interposer) and WLFO (fanout).
You will work with crossfunctional teams, including package design, substrate engineering, product engineering, reliability, test, quality, supply chain, and program management, to enabling stable, scalable manufacturing processes orchestrate seamless NPItoHVM transfers and drive yield, quality, and delivery performance across multiple external manufacturing sites.
THE PERSON:
This role combines strong advanced packaging process expertise with deep manufacturing and operations acumen, excelling at cross-functional integration and supplier enablement. Leveraging structured engineering methodologies such as DFM, DOE, SPC, FMEA, 8D, and Lean/Six Sigma. You will drive and ensure robust Processes of Record (POR), mitigate manufacturing risks, and accelerate ramp readiness for next-generation compute platforms-from enterprise server and client products to high-power AI accelerator systems.
KEY RESPONSIBILITIES:
NPI to HVM Industrialization
- Lead end-to-end industrialization of advanced package technologies from New Product Introduction (NPI) through High-Volume Manufacturing (HVM) readiness across external OSAT and foundry partners.
- Drive structured NPI-to-HVM processes, ensuring design, process, equipment, and quality readiness prior to volume ramp.
- Establish and maintain Process of Record (POR) for package assembly and test processes across multiple manufacturing sites.
- Coordinate ramp plans, risk mitigation strategies, and readiness reviews to ensure stable yield ramp and predictable manufacturing scale-up.
Design for Manufacturing (DFM) Integration
- Serve as the primary interface between package design, technology development, and external manufacturing partners to ensure manufacturable package architectures.
- Drive end-to-end DFM integration, identifying and resolving manufacturability gaps early in product development.
- Identify and close technology-to-manufacturing gaps to enable scalable deployment of next-generation packaging solutions.
- Contribute to continuous improvement of advanced package manufacturing methodologies and best practices across the supply chain.
External Supplier Manufacturing Management
- Partner with OSATs, foundries, and substrate suppliers to ensure manufacturing capability, capacity readiness, and process maturity for advanced packaging platforms.
- Monitor and drive yield, cycle time, quality, and delivery performance across external manufacturing sites.
- Lead supplier engagement on process optimization, defect reduction, and yield improvement initiatives.
- Conduct regular technical reviews, audits, and ramp readiness assessments with external manufacturing partners.
Yield, Quality, and Process Control
- Drive continuous improvement in manufacturing performance through DOE, SPC, FMEA, and data-driven root cause analysis.
- Lead cross-functional investigations for yield excursions, reliability risks, and field quality issues, ensuring timely containment and corrective actions (8D).
- Develop robust process monitoring frameworks and early detection mechanisms for advanced package assembly flows.
- Ensure alignment with corporate quality standards, reliability requirements, and product qualification criteria.
Cross-Functional Program Execution
- Collaborate with product development, package design, technology development, reliability engineering, product engineering, test engineering, supply chain, and program management to ensure aligned execution.
- Drive manufacturing readiness reviews, risk assessments, and ramp governance across multiple product lines.
- Support program teams in achieving cost, schedule, capacity, and production targets for Enterprise, Client, and AI accelerator products.
PREFERRED EXPERIENCE:
- Extensive years of experience in semiconductor packaging, assembly manufacturing, or product engineering, preferably in high-volume manufacturing environments.
- Proven experience driving New Product Introduction (NPI) and manufacturing ramp activities, including process qualification, manufacturing readiness, and yield ramp monitoring for advanced semiconductor packaging platforms.
- Experience working with internal manufacturing factories or external manufacturing partners, including OSATs, foundries, and substrate suppliers, supporting product ramp enablement, yield improvement, and manufacturing readiness.
- Demonstrated success driving yield improvement, defect reduction, and process optimization in high-volume manufacturing environments.
- Strong background in advanced packaging technologies, including 2.5D interposer architectures (e.g., CoWoS or similar), wafer-level fan-out (WLFO), and high-density flip-chip packages.
- Familiarity with front-end or wafer-level advanced packaging processes, including RDL (Redistribution Layer) and TCB (Thermo-Compression Bonding).
- Experience with panel-level packaging technologies or photonic integrated circuit (PIC) processing/packaging is considered a strong advantage.
- Solid understanding of Design for Manufacturing (DFM) principles and their application to semiconductor package design and assembly processes.
- Demonstrated experience in manufacturing problem solving and root cause analysis using structured methodologies such as DOE, SPC, FMEA, and 8D.
- Strong ability to analyze manufacturing data and drive yield, quality, and process improvements through data-driven decision making.
- Proven ability to work effectively in cross-functional environments, collaborating with package design, product engineering, reliability, quality, test, supply chain, and program management teams.
- Experience leading technical discussions and issue resolution with external manufacturing partners, including technical reviews and ramp readiness alignment.
- Excellent communication and stakeholder management skills, with the ability to translate complex engineering challenges into clear action plans across internal teams and suppliers.
- Fluent in English with strong written and verbal communication skills proficiency in Mandarin is required to effectively collaborate with manufacturing partners within the regional supply chain ecosystem. Korean language capability is a plus.
ACADEMICCREDENTIALS:
- Bachelor's or master's degree in mechanical engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related engineering discipline.
