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The Sputter Process Engineering team (RMO) is responsible for developing, optimizing, and sustaining thin‑film deposition processes for advanced PMR and HAMR media technologies. Based in Singapore and part of a global engineering network, we drive process excellence, yield improvement, and high‑volume manufacturing readiness. We collaborate closely with suppliers, R&D, and cross‑functional teams to enable next‑generation media performance through materials and process innovation.
As a key technical contributor, you will lead material performance and process integration for sputtering targets in high‑volume manufacturing.
Our Woodlands site is one of the largest electronics manufacturing sites in Singapore, housing our recording media operations. Spread over three sites, it is easily accessible via bus or from the MRT Station, with many employees taking mass transportation to work. Here at work, you can enjoy breakfast, lunch, dinner, and snacks at our onsite canteen and coffee shop. We offer a range of facilities including an in-house gym and dance studio, as well as after-work badminton and table tennis competitions. On-site celebrations and community volunteer opportunities also abound.
Location: Woodlands, Singapore, W2
Travel: None
With more than four decades of storage innovation, Seagate empowers humanity to thrive in the data age and helps people and businesses navigate the ever-expanding data landscape. We craft precision-engineered, cutting-edge solutions that help the world store and manage exponential data growth. Seagate is powered by our talented andpassionate workforce of 29,000 employees across the globe who embody our core values: integrity, innovation, and inclusion. Striving towards excellence every single day, we show up with these values for our customers, business partners, shareholders, and communities alike. Join us and get inspired to make a difference in the datasphere!
Job ID: 148780901
Skills:
Data Analytics, microstructural properties, target manufacturing processes, Xrd, material characterization, HIP bonding, sputtering target materials, TEM, Sem, Casting, magnetic measurements
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