Sr/ Process Development Engineer (Litho/CMP/Plating/Coating)

Key Responsibilities

Process Development & Optimization

• Lithography & Coating: Own development for advanced packaging, focusing on repeatability and high yield for panel-level solutions.

• Plating & CMP: Set up and qualify equipment for surface finishing, immersion plating, and planarization of metal/dielectric layers (e.g., copper, ABF, PI).

• Innovation: Lead efforts in process cost reduction, cycle time improvement, and yield enhancement through innovative process discovery and AI/ML applications.

Equipment & Tooling Support

• Define technical specifications and validate new R&D equipment for lithography and CMP.

• Collaborate with cross-functional teams and vendors to maintain and monitor peak tool performance.

Yield, Quality & Integration

• Defect Analysis: Proactively investigate and resolve process-related defects (e.g., lithography residues, plating voids, CMP dishing/scratching) using SEM, AFM, and optical inspection.

• Seamless Integration: Work with upstream/downstream process owners (e.g., etching, deposition) to ensure integration for SAP, Damascene, and build-up technologies.

• Risk Management: Drive data-driven risk management decisions for New Product Introduction (NPI).

Data Analysis & Documentation

• Perform statistical analysis (DOE, SPC) to identify and control critical process parameters.

• Document Standard Operating Procedures (SOPs), work instructions, and control plans.

Job Requirements

Education: PhD or Master's or Bachelor's degree in Materials Science, Chemical Engineering, Electrical/Mechanical Engineering, or a related field.

Experience: 5-10+ years of direct experience in lithography, plating, or CMP process development within semiconductor packaging or substrate manufacturing.

Technical Expertise:

• Hands-on experience with lithography metrology (CD-SEM, Filmmetrics) and recipe creation.

• Familiarity with thin film characterization tools (XRF, 4PP, ellipsometry, profilometer).

• Solid understanding of advanced packaging substrates (e.g., 2.5D/3D IC, interposers, ABF build-up).

If you are interested in the position , kindly send your CVs in to jasper.soh(@)randstad.com.sg.

Please include your availability, expected salary and reason for leaving your current job

We regret that only shortlisted candidates will be contacted.

EA: 94C3609 / Reg: R25154228