Introduction to GlobalFoundries
GlobalFoundries (GF) is one of the world's leading semiconductor foundries and the only one with a truly global footprint spanning three continents. We manufacture complex, feature-rich integrated circuits that enable billions of electronic devices. At GF, we make things that matter - from the solutions that enable the way we live today, to the technologies that drive what's possible for tomorrow. Join us in changing the industry that is changing the world. For more information, visit www.gf.com.
Summary
The Deputy Director, Integration & Yield will serve as a strategic program lead responsible for driving cross-functional transformation initiatives under the SPACE program. This role will focus on end-to-end program execution, integration strategy, and yield optimization across advanced technology nodes. The incumbent will collaborate closely with internal engineering teams on projects including Kepler, F7, and Advanced Packaging, to ensure successful delivery of key programs such as 28HV FeRAM, Kepler 1.0, and Kepler 2.0 HBM. This position requires strong leadership, technical depth, and program management expertise to align stakeholders and accelerate technology readiness.
Job Responsibilities
- Act as the overall SPACE program lead, driving transformation initiatives, governance, and execution across multiple workstreams.
- Lead cross-functional teams to deliver 28HV FeRAM, partnering with Kepler and F7 teams to ensure alignment on technology integration and execution milestones.
- Drive execution of Kepler 1.0 program, ensuring seamless collaboration across integration, module, and manufacturing teams to meet performance and yield targets.
- Partner with Advanced Packaging and Kepler teams to support development and integration of Kepler 2.0 HBM solutions, ensuring alignment of front-end and back-end processes.
- Establish and execute program roadmaps, timelines, and key deliverables to meet business and customer requirements.
- Monitor program performance, identify risks, and implement mitigation strategies to ensure on-time delivery and yield targets are achieved.
- Provide leadership and direction to engineering teams, fostering collaboration, accountability, and continuous improvement.
- Drive yield improvement strategies through data analysis, integration optimization, and cross-functional problem-solving.
- Facilitate communication and reporting to senior leadership, providing clear updates on program progress, challenges, and opportunities.
- Ensure alignment of program objectives with overall organizational and technology strategy.
Job Requirements
- Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Semiconductor Engineering, or related field.
- Minimum 10-15 years of experience in semiconductor manufacturing, with strong background in process integration, yield engineering, or program management.
- Proven experience leading large-scale, cross-functional programs in advanced semiconductor technologies.
- Strong knowledge of process integration, yield improvement methodologies, and semiconductor device fundamentals.
- Experience working with advanced nodes, embedded memory (e.g., FeRAM), or advanced packaging (e.g., HBM, 2.5D/3D integration) is highly preferred.
- Demonstrated ability to collaborate effectively with global teams, stakeholders, and senior leadership.
- Strong analytical, problem-solving, and decision-making skills with a data-driven mindset.
- Excellent communication and stakeholder management skills, with the ability to influence across all levels of the organization.
- Ability to thrive in a fast-paced, matrix environment and manage multiple priorities simultaneously.
