RESPONSIBILITIES / ACCOUNTABILITIES:
- Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs
- Could Manage multiple projects for package development from risk assessment, process /BOM establishment, qualification.
- Lead and Manage OSAT New Technology and New Product Introduction, Qualification, HVM, in a timely and flawless manner
- Strong problem-solving skill in Assembly engineering and leadership working with OSATs partner & cross functional team in Qorvo
- Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
- Strong communication, presentation skills, ability to excel in a dynamic collaborative team environment including working directly with the R&D, Quality and Product line is necessary.
- Provide best in class industry know-how to enable continued global leadership of QORVO package solutions
- Think and act professionally in the consistent Manner as a Qorvo engineering representative of on-site OSAT
- Manage/Coach QI's engineering resource from the daily work
- Position will be in Singapore which have Qorvo's strategic technology development center
- Could manage other work centers as well upon requested
REQUIREMENTS:
- Bachelor's or master's degree in mechanical engineering, Material Science engineering or a related field with a minimum of 10 years in semiconductor packaging or assembly engineering industry
- Good communication skill with open minded to learn semiconductor area: Bumping, DPS and Assembly process
- Good attitude, detail-orientated, proactive, quick learner and able to work effectively in a fast-paced environment
- Proven strong interpersonal and communication skills with willingness to take accountability
- Ability to address internal and external customer complaints and do multi-tasking
- Ability to lead cross-functional teams and drive supplier performance
