SPG SmartStart - Manufacturing Engineer

Responsibilities

• Develop, implement, and maintain methods, operating sequences, and processes for the assemblies during start-up for semiconductor equipment.

• Lead the development and sustaining of field digitalized start-up procedures (iOMS) for Tier 0 & Tier 1 operations to improve efficiency and consistency.

• Allocate tasks to illustrators and oversee progress to ensure timely and high‑quality OMS & DOC deliverables.

• Manage BoM integrity across SHPK, MERG, ship-along, SRD, and other configuration sources, ensuring accuracy and alignment with product requirements.

• Drive automation initiatives to enhance work proficiency and reduce production and delivery cycle times.

• Reduce I&W (installation and warranty) costs by identifying and correcting BoM errors, improving procedures, and lowering field NCs and start-up cycle time through streamlined work processes.

• Review field NCs, analyze root causes, and work with corresponding teams develop action plans to prevent recurrence.

• Coordinate technical issues, RIT initiatives, and the introduction of new technologies and CIP projects (e.g., 3D OMS) across different business units and cross-functional teams.

• Work independently with limited documentation when needed, investigating and compiling data to recommend improvements using established reporting processes.

• Collaborate with cross-functional teams to drive complex projects related to quality issues, BoM optimization, and cost reduction.

• Interface with engineering teams to support the release of product improvements and new product instructions.

• Perform root cause analysis for issues arising during assembly and start-up phases.

• Support engineering change requests and partner with design and operations teams to implement changes efficiently for both new and existing products

Requirements

Minimum Qualifications

• Bachelor's degree in engineering.

• Minimum 4 years of experience working with semiconductor equipment in manufacturing or technical field service.

Technical Skills

• Hands-on experience with semiconductor process equipment familiarity with any of the following is an advantage: MDP, EPI, ALD, CMP.

• Good understanding of mechanical, digitalization, and automation concepts, with the ability to read and interpret technical drawings and schematics.

• Good knowledge of system BoM structure, assembly processes, and procedure documentation.

• Proficiency with CAD software (e.g., SolidWorks), CAM tools (e.g., NX), SAP, and MS Office.

Professional Competencies

• Strong analytical and problem‑solving skills able to evaluate information and make sound decisions.

• Ability to work effectively within standardized processes to meet objectives and deadlines.

• Excellent communication skills and the ability to collaborate with multiple stakeholders and cross-functional teams.

• Strong independent work ethic and accountability.

Other Requirements

• Able to work flexibly, including outside standard working hours, to collaborate with stakeholders across different time zones.

• Willingness to travel internationally to customer sites (approximately 10%).