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THE ROLE:
The Power Integrity and Signal Integrity engineering team ensures the performance of the products are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization.
THE PERSON:
As a member of the Singapore SIPI team, you will be responsible for the electrical design and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board. You will be required to communicate effectively and work in close collaboration with others in AMD as well as with AMD's customers to ensure optimal engineering design decisions and efficient problem solving.
KEY RESPONSIBILITIES:
ACADEMIC CREDENTIALS:
LOCATION:
Singapore
Job ID: 150954873
Skills:
measurement tools , Usb, Ansys, DDR, Pcie, SI PI simulation, TDR, electromagnetic theory, de-embedding methodologies, packaging connector and board design for power signal integrity, Cadence, VNA, GDDR, SIwave, high-speed digital signaling interfaces, Ads, optical interconnects simulations, test board design fixtures, electrical modeling EDA tools, analog characterization, hfss, high speed oscilloscope, digital circuit analysis
Skills:
measurement tools , Usb, DDR, Pcie, SI PI simulation, TDR, electromagnetic theory, de-embedding methodologies, packaging connector and board design for power signal integrity, Cadence, VNA, GDDR, high-speed digital signaling interfaces, SIwave, Ads, optical interconnects simulations, test board design fixtures, Ansys HFSS, electrical modeling EDA tools, analog characterization, high speed oscilloscope, digital circuit analysis, processing of s-parameters
Skills:
measurement tools , Usb, Ansys, DDR, Pcie, SI PI simulation, TDR, electromagnetic theory, de-embedding methodologies, packaging connector and board design for power signal integrity, Cadence, VNA, GDDR, SIwave, high-speed digital signaling interfaces, Ads, optical interconnects simulations, test board design fixtures, electrical modeling EDA tools, analog characterization, hfss, high speed oscilloscope, digital circuit analysis
Skills:
measurement tools , DDR, Usb, Ansys, Pcie, SI PI simulation, de-embedding methodologies, packaging connector and board design for power signal integrity, Cadence, VNA, GDDR, SIwave, Ads, optical interconnects simulations, high speed oscilloscope, processing of s-parameters, TDR, electromagnetic theory, high-speed digital signaling interfaces, test board design fixtures, electrical modeling EDA tools, analog characterization, hfss, digital circuit analysis
Skills:
measurement tools , Usb, DDR, Pcie, TDR, SI PI simulation, electromagnetic theory, de-embedding methodologies, packaging connector and board design for power signal integrity, Cadence, VNA, GDDR, SIwave, high-speed digital signaling interfaces, Ads, optical interconnects simulations, test board design fixtures, Ansys HFSS, electrical modeling EDA tools, analog characterization, high speed oscilloscope, digital circuit analysis, processing of s-parameters