Senior Thin Film Process Engineer (ECP) JR11356

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

Further information can be found at www.st.com

YOUR ROLE

As a Senior Process Engineer, you will be the technical owner of the Electro‑Chemical Plating (ECP) copper process on the LAM Novellus SABRE platform. You will drive process development and sustaining activities, working closely with equipment engineering to characterize hardware, resolve complex issues, and continuously improve process robustness, yield, and overall tool performance.

• Develop, optimize, and sustain ECP Cu reinforcement / damascene fill processes on Novellus SABRE tools.
• Define and tune recipes and hardware configurations to achieve target thickness, uniformity, fill performance, and defect levels.
• Collaborate with PVD barrier/seed and integration teams to ensure strong linkage between upstream processes (Ti, TiN, CVD‑TiN, Cu seed, etc.) and downstream ECP performance.
• Perform structured hardware and process characterization, including experiments on flow, contact design, waveform, and chemistry conditions.
• Lead troubleshooting and excursion management, conduct systematic root‑cause analysis, and implement permanent corrective and preventive actions.

YOUR SKILLS & EXPERIENCES

• Bachelor's or Master's degree in Electrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering, or a related discipline.
• Min 5 years of hands‑on experience with ECP copper processes on LAM Novellus SABRE systems in a semiconductor fab environment.
• Solid knowledge of semiconductor manufacturing, vacuum technology, and thin‑film deposition, including PVD barrier/seed fundamentals.
• Strong collaboration and communication skills: able to document and present findings clearly through technical reports, reviews, and data summaries active participation in cross‑functional forums and project teams.
• Proven problem‑solving capability, including advanced root‑cause analysis, failure‑mode identification, and implementation of robust, sustainable solutions.