The client of ours is a Multinational Conglomerate with presences across America, Europe and APAC within the Semiconductor Industry is currently expanding their R&D team here in Singapore. They are seeking a highly experienced Senior Thermal Engineer to lead thermal analysis and cooling solution development for advanced semiconductor and electronics systems. This role is focused on designing and validating efficient thermal management solutions for high-power-density electronic components and devices.
You'll need to have a strong foundation in electronics cooling, with at least 50% of recent experience dedicated to thermal analysis. This includes hands-on work in liquid cooling, CFD modeling, and experimental validation. Leadership experience is highly valued, as this role may involve managing and mentoring a team of engineers while driving critical thermal design initiatives.
Key Responsibilities:-
Thermal Design & Electronics Cooling
- Design and develop advanced thermal management solutions for semiconductor devices, including CPUs, GPUs, power electronics, and high-density packaging.
- Focus on liquid cooling technologies (e.g., cold plates, microchannel cooling, immersion cooling) for efficient heat dissipation.
- Analyze and optimize heat transfer paths to move heat effectively from chips and packages to external cooling systems.
Thermal Analysis & CFD Modeling
- Perform detailed thermal simulations using CFD and analytical modeling tools.
- Model conjugate heat transfer involving conduction, convection, and, where applicable, phase change.
- Simulate airflow and liquid cooling performance across electronic assemblies and enclosures.
- Interpret simulation results and provide design recommendations to improve thermal performance.
Thermal Expansion & Reliability
- Conduct thermal expansion and thermo-mechanical analysis to ensure reliability of semiconductor packages and assemblies.
- Assess the impact of temperature cycling on materials, interfaces, and structural integrity.
Experimental Validation & Lab Testing
- Plan and execute thermal testing in lab environments, including temperature measurements, flow characterization, and heat flux analysis.
- Use sensors such as thermocouples, RTDs, and infrared imaging tools.
- Correlate experimental data with CFD and thermal models to validate and refine designs.
Leadership & Project Ownership
- Lead and mentor a team of thermal engineers, providing technical direction and oversight.
- Drive end-to-end thermal development from concept through validation and production support.
- Coordinate with cross-functional teams including chip design, packaging, mechanical, and reliability engineering.
- Ensure project milestones, performance targets, and quality standards are met.
Materials & Surface Engineering (Preferred)
- Evaluate materials used in thermal interfaces, heat exchangers, and cooling systems.
- Analyze properties such as thermal conductivity, corrosion resistance, մակ abrasion resistance, and surface roughness.
- Support material selection for long-term reliability in semiconductor environments.
Qualifications:
- Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field.
- Extensive experience in thermal engineering, with at least 50% of recent work focused on thermal analysis.
- Strong background in electronics cooling, particularly within semiconductor or high-performance computing environments.
- Proven experience with liquid cooling technologies.
- Proficiency in CFD tools (e.g., ANSYS Fluent, Icepak, Star-CCM+ or equivalent).
- Hands-on experience with thermal testing, measurement techniques, and lab instrumentation.
- Solid understanding of heat transfer principles and thermal-fluid sciences.
Morgan McKinley Pte Ltd
Nicholas Lim
EA Licence No: 11C5502
EA Registration No: R23116117
