Responsibilities
- Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions.
- Collaborate with internal R&D and module engineering teams to define, refine, and execute SiPh process flows.
- Interface directly with customers to align device and process requirements through technical discussions and solution deep dives.
- Coordinate with external OSATs and assembly partners for Photonic Integrated Circuit (PIC) and Electrical Integrated Circuit (EIC) characterization and packaging integration.
- Implement DOE, FMEA, and control plan methodologies to ensure robust technology development and effective risk mitigation.
Requirements
- Bachelor's degree in Electrical/Electronics Engineering, Physics, Materials Engineering, or a related field.
- Minimum 3 years of hands-on experience in Silicon Photonics (SiPh) R&D, process integration, or device characterization.
- Strong background in SiPh process development, optical device design, or photonic IC packaging.
- Familiarity with semiconductor foundry operations and module-level process integration.
- Proficient in using DOE, FMEA, control planning, and data-driven analytical tools for problem-solving.
- Excellent cross-functional collaboration and communication skills for engaging with internal teams and external partners.
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [Confidential Information]
EA License No: 13C6305
Reg. No.: R1985234 (GOH HOOI MING)
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