Lead end-to-end product development from concept, feasibility, design validation, qualification to production ramp
Mentor junior engineers and provide technical leadership within the team
Develop and execute prototype build/ new materials characterization, including optical, electrical and mechanical assessment with DOE (Design of Experiment) execution.
Lead and resolve major issues during project and maintain documentations pertaining to engineering root cause findings
Collaborate and drive cross functional integration across design process, packaging, test, reliability and production teams
Analyse parametric and yield data to identify trends and drive root cause analysis. Support yield improvement, failure analysis, and reliability testing activities.
Create and maintain engineering documentations including BOM, defect catalog, control plans and ERS.
Drive continuous improvements in development methodologies, cost and cycle time
Requirements:
Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
5 years in either R&D, packaging technologies, manufacturing environment
Experience in sensor module packaging and/or optical engineering will be an advantage.
Ability to lead/mentor junior team members and providing technical expertise in coaching them
