Responsibilities:
- Drive process improvements and CIPs to enhance product yield
- Conduct DOE's, experimental trials, and data analysis
- Define new process flows and lead internal feasibility studies
- Serve as subject matter expert in process development
- Analyze hybrid/fusion bonding yield issues across upstream/downstream flows
- Optimize processes and analyze data for hybrid bonding and annealing
- Develop SOPs, technical documentation, and BKM process flows
- Facilitate knowledge transfer between on-site support teams
- Support machine operation and application setup
- Prepare and execute customer demos recommend process flows
- Provide technical solutions for customer process issues in collaboration with field teams
- Investigate process issues on-site and support Engineering team
Requirements:
- Master's or PhD in Mechanical/Electrical/Electronics/Physics Engineering
- 5+ years in C2W/W2W hybrid bonding and front-end/back-end wafer fab
- Proven experience in process issue resolution, optimization, and new process setup
- Hands-on experience with semiconductor equipment, defectivity, and yield engineering
- Strong process development expertise with clear problem-solving communication
- Proficient in MS Office, JMP, MATLAB
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [Confidential Information]
EA License No: 13C6305
Reg. No.: R24121656 (CHEN JING WEI)
For candidate who applied for the advertised position is deemed to have consented to us that we may collect, use or disclose your personal information for purpose in connection with the services provided by us.
