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Role Summary
The SMTS acts as a technical authority in 3D NAND cell film development, setting strategic direction and leading multi-functional initiatives to drive department-wide impact by architecting solutions, accelerating innovation adoption, influencing technical standards, and mentoring engineers to elevate technical excellence. Defines technical strategy and drives cross-org adoption leads complex problem solving across process/hardware/device interactions with no yield trade-off builds the SME pipeline through structured mentorship.
Main Responsibilities
Define technical strategy architect solutions influence technical standards and drive process improvements lead advanced process development, fixing, and integration.
Integrate unit processes into full cell packages and validate device/process linkages via wafer-level electricals.
Drive complex problem solving across process/hardware/device interactions (RCA, FMEA, SPC, corrective actions recovering window without yield trade-off).
Use advanced characterization (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance and develop correlation models predicting reliability/scaling behavior.
Lead vendor engagements to push capability publish internal papers/BKMs present to senior leadership uphold TLP tenets (Innovate, Focus, Impact, Influence, Lead, Mentor).
Other Responsibilities
Mentor engineers through structured development build SME pipelines publish internal papers/BKMs and present to senior leadership uphold Micron's technical leadership expectations
Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one's scope of work.
Candidate Profile
Minimum Qualifications / Experience
PhD ≥12 yrs, or Master's ≥15 yrs, of relevant experience in
Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,
Experience in Thin Film R&D for NAND, specifically in Diffusion, CVD, and Cell Film technologies
Proven track record of architecting technical solutions & process-device correlation
Publications/patents and strong record of technical contributions.
Must-Have Technical Skills
Deep expertise in ALD/CVD thin film processing, including nitride/oxide systems, inhibitor chemistries, multi‑layer ONO stacks, and barrier/protection layers, with proven ability to architect robust solutions for advanced 3D NAND integration.
Hands‑on leadership experience in cell film hardware and equipment optimization, including precursor delivery, temperature control, chamber matching/segregation, batch vs. single‑wafer trade‑offs, and metrology hook integration.
Strong command of process-device interactions, reliability modeling, and 3D NAND scaling, with the ability to correlate materials, structures, and electrical behavior to enable scaling and sustain yield.
Expert use of advanced characterization techniques (SIMS, XPS, TEM, EDX/EELS, electrical stress testing) to drive root‑cause analysis, window recovery, and predictive correlation models without yield trade‑offs.
Proven ability to lead complex technical problem‑solving, mentor engineers, influence cross‑functional teams and vendors, and build organizational capability through knowledge sharing and structured development.
Must-Have Soft Skills
Structured problem-solving and learning agility in an R&D environment.
Clear communication and cross-functional collaboration.
Embody Micron's core values:
People - Respect, develop and empower others
Innovation - Drive continuous improvement and breakthrough thinking
Tenacity - Show grit and determination
Collaboration - Build trust and foster teamwork
Customer Focus - Deliver excellence and value
Job ID: 147095581
