MAIN DUTIES: Design and develop series of marking/inspection/ sorting/customised semiconductor equipment to meet the processing and automation needs of customers. Responsibilities:
Design standardization
Costing and project management
Machine and module conceptualization design
Design for manufacturing (DFM), design for assembly (DFA) and Concurrent engineering
Pneumatic/ hydraulic circuit design
Detail fabrication drawings, assembly drawings and layout drawings
Selection and sizing of standard components available off the shelf
Undertake new product development or be involved in sustaining engineering/CIPs
Requirements:
Bachelor/ Master of Engineering with minimum 5 years relevant experience
3D solid Modelling, preferably Pro-E (others like Solid Edge, Auto Inventor, Mechanical Desktop, Solid Designer are also acceptable).
Ability to execute mechanical designing of Ultra High Precision machines & High Speed Pick and Place mechanisms
Strong project management skills
Preferably with Good track record in 1 or some of the following:
1. Structural, kinematics and dynamic analysis and FEA simulation 2. Geometrical tolerance and dimensional analysis (e.g. stack up error) 3. Engineering material selection 4. Design troubleshooting 5. Application of analysis tools like FMEA, DOE We regret that only shortlisted candidates will be notified. GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671