Design and develop precision mechanical systems, multi-axis motion mechanisms, wafer handling modules, and automated test equipment (ATE) interfaces.
Design thermal management solutions, including thermal chucks, cooling systems, and temperature-controlled fixtures for semiconductor testing.
Perform 3D CAD design, tolerance analysis (GD&T), FEA, and CFD simulations to optimize structural integrity, thermal performance, and reliability.
Develop and validate mechanical prototypes through assembly, testing, and design verification.
Collaborate with electrical, software, manufacturing, and process engineering teams to ensure successful product integration.
Work with suppliers and manufacturing partners to select suitable materials and production methods, including CNC machining, precision grinding, and additive manufacturing.
Drive design improvements to enhance product performance, manufacturability, and cost efficiency.
Requirements
Bachelor's or Master's Degree in Mechanical Engineering, Mechatronics, or a related discipline.
At least 5 years of experience in precision mechanical design, preferably in the semiconductor equipment, robotics, automation, or precision engineering industry.
Proficient in 3D CAD software such as SolidWorks, Creo, or Autodesk Inventor.
Hands-on experience with FEA and CFD simulation tools (e.g., ANSYS or SolidWorks Simulation).
Strong knowledge of GD&T (ASME Y14.5), tolerance analysis, and precision mechanical design principles.
Good understanding of material properties, thermal expansion, structural analysis, and precision manufacturing processes.
Experience with wafer probers, probe cards, load boards, ATE systems, cleanroom design requirements, or precision motion control technologies is an advantage.